Req#: bWiSaSxxsygdEmployer Industry: Semiconductor Technology
Why consider this job opportunity:
- Opportunity to work at the forefront of semiconductor technology and innovation
- Collaborate with industry leaders and research pioneers in a cutting-edge facility
- Potential for significant impact on the future of semiconductor packaging solutions
- Mentorship and leadership opportunities within a mission-driven organization
- Chance to contribute to a robust patent portfolio and publish in peer-reviewed journals
What to Expect (Job Responsibilities):
- Lead research initiatives in advanced semiconductor packaging, focusing on 3D and 2.5D integration
- Design and develop innovative packaging architectures to enhance device performance
- Guide the prototyping and validation of advanced packaging solutions
- Collaborate with cross-functional teams to drive packaging innovation
- Author technical publications and present findings at industry conferences
What is Required (Qualifications):
- Ph.D. in Materials Science, Mechanical Engineering, or a related field
- 5+ years of experience in semiconductor packaging research or development
- Expertise in 3D integration technologies, including stacked die and through-silicon via (TSV)
- Strong background in materials science with experience in novel materials for packaging
- Proven project leadership skills with experience driving cross-functional initiatives
How to Stand Out (Preferred Qualifications):
- Industry experience in semiconductor packaging, particularly with large-scale production processes
- A robust patent portfolio showcasing innovations in advanced packaging
- Expertise in heterogeneous integration techniques, including chiplet architectures
- Experience in developing advanced materials for high-performance packaging solutions
- Proficiency in simulation and modeling tools to analyze and optimize packaging designs
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