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Job Description:

• Establish, enhance, calibrate and/or maintain in-house IC Package Mechanical Reliability Test Facilities such as Temperature Cycling Chamber, High Current Electromigration testers, Drop testers and Warpage Measurement system

• Formulate DOEs and run above tests on large number of IC package samples, for engineering characterization and product/technology qualification for interconnect reliability at the package and board levels

• Liaison with external labs for running environmental stress tests for product/technology qualification per in-house and customer specifications, performing failure analysis & root-causing the failures and determine the corrective actions

• Work closely with IC Package Design and Technology Development engineers for IC packaging material characterization, Chip-Package-Interaction for new silicon process node technologies and new package technology qualification

• Perform Finite Element Modeling and Analysis for studying the warpage behavior of IC packaging structures and the stress on bump/ball interconnects

• Work with Thermal and Signal/Power Integrity engineers for co-simulation and testing for co-design

• Collaborate with teams from external customers, Broadcom Business Units and the QA department and help debug mechanical failures during stress tests and in the field, if any, and find appropriate remedies

Job Requirements

• BS/MS/PHD in Mechanical Engineering / Material Science

• Minimum work experience: 8+ years for Bachelors / 6+ years for Masters / 3+ years for Ph.D. in IC packaging reliability

• Hands on experience with IC Package mechanical reliability testers such as Temperature Cycle Chamber, Drop tester and/or Electromigration tester and a DYI attitude to build, maintain and fix these machines

• Power user of Finite Element Modeling tools such as Ansys Mechanical and hands on experience with mechanical design tools such as AutoCAD and/or layout tools such as Cadence APD

• Strong fundamentals on the materials science and mechanical behavior of IC packaging structures with heterogeneous material stacks and interconnect structures under different thermal, mechanical and electrical stress conditions

• Knowledge on IC package assembly processes such as flip chip, wirebonding and surface mounting and advanced packaging technologies for heterogeneous integration using 2.5D/3D stacking

• Track record of innovation through patents and publications

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $91,200 - $152,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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