IBM is seeking a Research Scientist for a position in the discipline of thin film research and development at T. J. Watson Research Center in Yorktown Heights, NY. The successful applicant will conduct experimental studies directed toward a fundamental understanding of the mechanisms underlying thin film growth and interface control for both metal and dielectric materials. Required skills include theoretical understanding of thin films and their interfaces, expertise in the fundamental principles of and direct operational experience with deposition techniques including physical and chemical vapor deposition and atomic layer deposition, and facility with analytical techniques appropriate to thin films. Additionally, familiarity with semiconductor device fabrication is strongly desired and basic understanding of semiconductor device physics, a differentiator. The successful candidate will demonstrate strong teamwork skills and is expected to work closely with other staff in the thin films group, as well as with researchers from other disciplines including surface preparation, reactive ion etch, chemical mechanical polishing and photolithography. The technical goals for this position include collaborative efforts to invent, develop and demonstrate processes that impact current and future device and interconnect technologies. These goals center on developing materials with precisely defined physical attributes including atomic layer precision in thickness and interfacial transitions, tightly controlled thermal and electrical properties and resistance to attack by aqueous and gaseous ambients, including the presence of energetic ions. The successful candidate will be responsible for applying these developed processes and fabrication technologies to an advanced prototyping environment. Additional critical requirements: demonstrated ability to define and execute incisive experiments, theoretical analysis and interpretation of experimental data, presentation in technical /executive review meetings and scientific conferences, interaction with internal/external clients and interdisciplinary expert teams to understand needs and develop timely and creative solutions.
- Understanding of / experience with device integration and device physics.
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