Job Details:

Job Description:

About the group:
Wafer Assembly Technology Development (WATD) develops and delivers Intel's roadmap for advanced wafer-level packaging technologies. Our research and development organization enables architectural solutions.

About the role

As the Engineering Area Manager for WATD, you will be responsible for leading a high performing TD engineering team and developing modules supporting industry leading wafer-scale packaging. In this role you will be collaborating with WATD Modules, Die Sort, Materials TD, Integration teams in ATTD, WATD manufacturing, and GSEM to establish module and equipment specs, bring in the next generation tools and establish world class HVM ready processes. You will also be responsible for establishing the future technology roadmap and driving pathfinding initiatives in your area. You will be responsible for spending and capital planning and management as well as demonstration of best-in-class safety performance and operational excellence in terms of quality, output, and cost within specified modules. This position is in Oregon and reports directly to the WATD Back-End Engineering Director.

Qualifications:

Bachelor's degree, or master's degree in a Mechanical Engineering or Chemical Engineering or Materials Science, as well as 8+ years (MS) or 12+ years (BS) of experience in Si process technology development
5+ years of track record as exceptional manager and leader.

Preferred Qualifications:
20+ years (BS) of experience in Si process technology development

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.